(2019) Published in Advanced Functional Materials
- Joonsoo Jeong
- 2021년 10월 27일
- 1분 분량
A journal article entitled "Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)" has been published in ADVANCED FUNCTIONAL MATERIALS (Impact Factor: 13.3)
Comments